Technical Data
Lead free
yes
Heating area
460 x 410 mm
Heating system
top und bottom - separated and selektive controled
Clearance for assemblies
max. 35 mm
Heating controlling
Free programmable control for temperature curve setting
Heat distribution
high power heating element with force air heating method
Cooling
Dual-channel air circulation for fast cool-down process - exhaust port will be automatically open
Heating temperatures
30 - 300 C
Soldering process time
ca. 4 - 5 min per cycle of 300x200 mm PCB
Rated power
max. 3500 W / typ. 1200 W
Features
cost effective soldering process
stores up any number of profiles
fully automatic, fully static ( non moving rail ) operation
for single or double side board soldering
large transparent glass window see trought the soldering process
Power requirements
220 VAC / 50Hz
Dimension and wight
675 x 630 x 300mm / ca.55 kg
Lead free
yes
Heating area
460 x 410 mm
Heating system
top und bottom - separated and selektive controled
Clearance for assemblies
max. 35 mm
Heating controlling
Free programmable control for temperature curve setting
Heat distribution
high power heating element with force air heating method
Cooling
Dual-channel air circulation for fast cool-down process - exhaust port will be automatically open
Heating temperatures
30 - 300 C
Soldering process time
ca. 4 - 5 min per cycle of 300x200 mm PCB
Rated power
max. 3500 W / typ. 1200 W
Features
cost effective soldering process
stores up any number of profiles
fully automatic, fully static ( non moving rail ) operation
for single or double side board soldering
large transparent glass window see trought the soldering process
Power requirements
220 VAC / 50Hz
Dimension and wight
675 x 630 x 300mm / ca.55 kg
